JPH0723865Y2 - 基板型温度ヒューズ - Google Patents
基板型温度ヒューズInfo
- Publication number
- JPH0723865Y2 JPH0723865Y2 JP4593288U JP4593288U JPH0723865Y2 JP H0723865 Y2 JPH0723865 Y2 JP H0723865Y2 JP 4593288 U JP4593288 U JP 4593288U JP 4593288 U JP4593288 U JP 4593288U JP H0723865 Y2 JPH0723865 Y2 JP H0723865Y2
- Authority
- JP
- Japan
- Prior art keywords
- thermal fuse
- insulating substrate
- low melting
- melting point
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 26
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4593288U JPH0723865Y2 (ja) | 1988-04-04 | 1988-04-04 | 基板型温度ヒューズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4593288U JPH0723865Y2 (ja) | 1988-04-04 | 1988-04-04 | 基板型温度ヒューズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01148635U JPH01148635U (en]) | 1989-10-16 |
| JPH0723865Y2 true JPH0723865Y2 (ja) | 1995-05-31 |
Family
ID=31272220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4593288U Expired - Lifetime JPH0723865Y2 (ja) | 1988-04-04 | 1988-04-04 | 基板型温度ヒューズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723865Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5282897B2 (ja) * | 2009-03-12 | 2013-09-04 | 住友電装株式会社 | ヒューズ |
-
1988
- 1988-04-04 JP JP4593288U patent/JPH0723865Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01148635U (en]) | 1989-10-16 |
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